Hexin has 15 years of experience in the production of hardware shielding covers. Many customers who have contacted have doubts about the opening and heat dissipation of the hardware shielding cover. They feel that opening a hole is to facilitate the heat dissipation of the components in the shielding cover. The editor explains here today:
The opening is not to dissipate the heat of the components in the hardware shielding cover, but to dissipate the uniform heat of the reflow oven in the SMT production process. The heat and other components in the shielding cover mainly rely on grounding for heat dissipation. At the same time, the opening is to facilitate the inspection after the patch and SMT.
There are mainly two designs of hardware shielding cover: One is to use a shielding frame and a shielding cover. The shielding frame needs SMT and the shielding cover is not needed. Therefore, the shielding cover does not need to be opened at this time. The other is to use only the shielding cover. SMT is required, and holes are required on the top, otherwise it will be easily displaced by heat during reflow.