SMT Shield Clips
This clip is to be mounted onto the surface of a PCB (SMT) and offers a fast solution for assembling RFI/EMI-shielding cans to PCBs. This clip eliminates the need for through holes and post reflow operations on the PCB. For best performance, the shielding clip should be mounted on the PCB ground area. This can be done by hand or by vacuum pick-up nozzle (automated).
SMT Shield Clips
SMT devices offering a fast solution for assembling RFI shields to PCBs.
Advance
Eliminates the need for through holes and post reflow operations.
Save
Saves PCB real estate.
Stander Size SMT Shield Clips
| Part Number | Length(mm) | Width(mm) | Height(mm) | Fit for shield(mm) | Material Description |
|---|---|---|---|---|---|
| HX151213 | 1.5 | 1.2 | 1.3 | 0.65 | SUS301 With TinPlated |
| HX211213 | 2.1 | 1.2 | 1.3 | 0.65 | SUS301 With TinPlated |
| HX44080-015 | 4.4 | 0.8 | 0.8 | 0.15 | SUS301 With TinPlated |
| HX44080-020 | 4.4 | 0.8 | 0.8 | 0.2 | SUS301 With TinPlated |
| HX521213-015 | 5.2 | 1.2 | 1.3 | 0.15 | SUS301 With TinPlated |
| HX650908-020 | 6.5 | 0.9 | 0.8 | 0.2 | SUS301 With TinPlated |
| HX650812-015 | 6.5 | 0.8 | 1.28 | 0.15 | SUS301 With TinPlated |
| HX650812-020 | 6.5 | 0.8 | 1.28 | 0.2 | SUS301 With TinPlated |
| HX650812-030 | 6.5 | 0.8 | 1.28 | 0.3 | SUS301 With TinPlated |
| HX29154163 | 2.9 | 1.54 | 1.63 | 0.55 | SUS301 With TinPlated |
| HX45125125 | 4.5 | 1.25 | 1.25 | 0.65 | SUS301 With TinPlated |
| HX80153-020 | 8.0 | 1.5 | 3.0 | 0.2 | SUS301 With TinPlated |
MATERIAL
FINISH / PLATING ON TERMINATION:
100% Tin over Nickel
FINISH / PLATING ON CONTACT SURFACE:
100% Tin over Nickel
BASE MATERIAL OF CONTACT:
Stainless Steel
PACKAGING STYLE:
Tape and Reel
SPECIFICATION
CONNECTOR ORIENTATION:
Vertical
CONNECTION TYPE:
Surface Mount (SMT)
OPERATING TEMPERATURE:
-40°C to +85°C
SOLDERING DATA:
Max Solder Temperature: 250°C for 5 seconds
PACKING
SMT Shield Clips 3D View
RFI SMT Shield Clips & Can
Reduce costs, yet increase reliability
By removing the need to solder cans directly to the PCB, multiple savings can be made:
• Eliminate expensive manual soldering operations – PCB assembly costs are dramatically reduced.
• Eliminate hot and cold spots on the PCB, reducing potential long term failure caused by thermal damage.
• Eliminate expensive rework for maintenance and circuit adjustment, by easy access under the can.
• Reduce the cost of the Can itself by using a simple 5-sided construction.
RFI/EMI Shield cans are the most popular way of providing protection against the effects of RFI and EMI. They create a Faraday cage around the sensitive or emitting circuits, preventing interference disrupting the device.
• Fixed into place, using expensive hand-soldering;
• Cannot be easily or safely removed for maintenance or repair – risk of PCB damage;
• Two-piece cans (for later access) are expensive products.
